info@m-t-g.com| (508) 337-3388
Integrated Circuits
  • Audio
  • Noise Cancellation
  • Headphone Amplifiers
  • Speaker Amplifiers
  • Power Management
  • Battery Chargers
  • Comparators
  • Buck-Boost Converters
  • Step Up/Down Converters
  • Real Time Clocks
  • Supervisors
  • A/D & D/A Converters
  • Analog Switches
  • Digital Potentiometers
  • RF Products
  • Lightening Sensor
  • Sensor Tags
  • RFID
  • RF-Transceivers
  • Line Regulators
  • Dropout Voltage
  • Dual Output
  • Linear Controller
  • ASIC/Foundry
  • Analog ASICs
  • Foundry Services
  • Switching Controllers
  • Signal/Duel Phase
  • Switching LDO Controller
  • Interfaces
  • Capacitive Sensors
  • FlexRay Transceivers
  • Industrial Products
  • Power Control
  • Discrete-to-Digital
  • Lighting Control
  • Military/Avionics Devices
  • ARNIC 429,571,575
  • Line Drivers/Receivers
  • Line Receivers
  • Transceivers
  • Power Control
  • Op Amps
  • Discrete-to-Digital
  • Voltage Comparators
  • ADC/DAC Devices
  • Lighting Control
  • DLA DSCC Memory
  • SRAM/DRAM
  • SDRAM/VRAM
  • EEPROM
  • Flash/microSSD
Discrete Semiconductors
  • MOSFETs
  • N-Channel and P-Channel
  • Packages include TO-92, TO-252, TO-251, TO-92, STO-89, TO-220, PMPAK 5X6, TO-223, TO-220
  • Small Signal
  • Medium Signal
  • Diodes
  • Zener Diodes
  • Bridge Rectifiers
  • Switching Diodes
  • High Voltage Rectifiers
  • High Efficient Rectifiers
  • Fast Recovery Rectifiers
  • High Voltage Fast Recovery Rectifiers
  • Schottky Rectifiers
  • Standard Recovery Rectifiers
  • Small Signal Schottky Diodes
  • Ultra-Fast Recovery Rectifiers
  • Super-Fast Recovery Rectifiers
  • Transistors
  • Small Signal Bipolar Transistors
  • Medium Power Bipolar Transistors
  • Pre-biased Transistors
  • Protection Devices
  • Transient Protection
  • TVS
  • DIAC
  • Thermal Protection
  • Thermistors
  • Data Line Protection
  • ESD Protection Devices
Capacitors
  • Aluminum Electrolytic Capacitors
  • Surface Mount
  • Snap-In
  • Computer Grade (Screw Terminal)
  • Axial
  • Radial
  • Subminiature
  • Standard
  • Wide/High Temperature
  • Low Leakage/Inductance
  • Non-polar
  • Extra Long Life
  • Photo Flash
  • Organic Polymer
  • Solid Tantalum Capacitors
  • Ultra Miniature (1005-1316L size)
  • Low Profile (1.2mm max)
  • Automotive/High Temperature
  • Ultra Low ESR
  • Built-in Fuse
  • Conductive Polymer
  • Molded/Dipped Epoxy Package
  • Wet Tantalum/MIL-39006
  • Film Capacitors
  • Polyester, Polypropylene, PET, PPS dielectrics X2Y-Type
  • Through-hole & SMT Film Capacitors
  • Snubber caps & Custom Capacitor Modules
  • THD Series for A/C Filter Applications
  • SLTG Series Lighting Tower Strobe Capacitor Banks
  • X382-3PH ASE Series 3 Phase Filter Capacitors
  • Inverter Bus Link Capacitor for ripple current/filtering
  • Dry and Oil Filled Capacitors
  • Ceramic Capacitors
  • SMT & Radial High Voltage MLCCs
  • High Frequency SMPS Capacitors(MIL-PRF49470)
  • Planar Arrays & Discoidal Capacitors
  • EMI/RFI Filters
  • EDLC (Supercapacitors)
  • Aqueous Electrolyte Pulse Applications
  • Capacitance to 700mF with no de-rating
  • Voltages from 1.4-18 Volts
Resistors-Inductors-Circuit Protection
  • Leaded and SMT Resistors
  • High-Voltage Resistors up to 3.5KV
  • High-Value Resistors up to 1 tera-ohm
  • HC Bondable Resistors
  • MCH Military/High Reliability, High Voltage Resistors
  • Leaded & SMT Dividers
  • LLeaded and SMT Configuration available
  • High Voltage Leaded Resistors up to 40kV
  • Inductors & Magnetics
  • RF Inductors
  • Pot Cores
  • Toroid Inductors
  • Thru-hole & SMT Available
  • Transformers
  • Tunable Coils
  • Power Magnetics
  • Common-Mode Chokes
  • Micro/Ultra-miniature Designs
  • COTS and Mil-PRF Qualified Products
  • Circuit Protection Components
  • Circuit Protector
  • Micro Fuse
  • High Current Fuses
  • Surge Absorber
  • Thermostats
Lighting Management & Sensors
  • Optoelectronic Sensors
  • Ambient Light Sensors (ALS)
  • ALS & Proximity Detection
  • Light-to-Digital
  • Proximity Detection
  • Color Sensors
  • Light-to-Frequency
  • Light-to-Voltage
  • Linear Sensor Array
  • Lighting Management ICs
  • Camera Flash LED Drivers
  • Camera Flash XENON Drivers
  • LED drivers
  • LED Power Supplies
  • Lighting Management Units
  • Encoders
  • Magnets
  • Linear Position Sensors
  • Rotary Position Sensors
  • 3D absolute Position Sensors
  • MEMS Gyroscopes
  • Single, duel and Triple Axis
  • Accelerometers
  • Temperature Sensors
  • Thermostats
  • Thermal Sensors
Electro-Mechanical & Interconnect
  • PCB Connectors
  • Autoheaderâ„¢ Technology
  • Custom Pin/Blade Headers
  • RFI Shield Clips
  • Shape Memory Alloy Actuators
  • PCB Pins
  • Solderball Pins
  • Stamped Terminals
  • Compliant/Press Fit
  • Crimping Products
  • Automation Equipment
  • Multisert
  • Minisert
  • Compact Mini
  • MiniPin
  • Feeders
  • Heavy Copper Circuit Boards
  • High Current/High Power Applications
  • Copper thickness up to 12 oz. (.16"/400 micron)
  • Spacing between conductors as narrow as .35"/.89mm with 12 oz. copper
  • Polymer Thick Film Processing
  • Simple solution for contacts, keypads, switches and resistors
  • Metal Clad Laminate Processing
  • Printed Circuit Boards with improved thermal conductivity based on insulated metal base construction
  • Single-sided copper circuits with dielectric insulator and a solid metal backing plate
  • Electro-Mechanical Services
  • Lead Attachment
  • High Temperature Attach
  • JEDEC M0-110
  • JEDEC M0-111
  • Spider J
  • Spider Gullwing
  • Thru-hole Mountable
  • SMT Lead Alignment
  • Package Trim & Form
  • BGA Reballing
  • XRF Screening
  • Robotic Hot-Solder Dip
  • Solder Exchange
  • GEIA-STD-0006 Compliant
  • Micropen 3D Scribing
  • Proprietary Scribing Technology
  • 3D Programmed Patterns
  • Wide range of viscosity
Thermal Management Solutions
  • Components
  • Laser Diode Surmounts & Detectors
  • RF/Microwave Substrates
  • Hybrid Thick Film Substrates
  • Ceramics Lapped/Polished
  • Aluminum Nitride
  • Beryllium Oxide
  • Alumina
  • Ceramic Services
  • Ceramic Machining
  • Metallization
  • Gold/Tin
  • Thermal Grease
  • Original Non-Silicone
  • Non-Metal
  • Metal-Filled
  • Electrically Conductive
  • High Temperature
  • Patented Thermal Pads
  • Pre-Formed Gap Filling Pad
  • Custom die-cutting to your specifications
  • Fans and Blowers
  • Axial/Radial fans
  • Duct fans
  • Roof/Inline tube fans
  • Hot Gas Fans
  • Cross Flow Fans
  • Single & Double Inlet centrifugal fans
  • Backward curve centrifugal fans
  • Free-Blowing fans
  • Switches and Controllers
  • External Rotor motors
  • AC/DC Axial fans
  • AC 400Hz Axial fans
  • High Performance fans
  • Thermal Management
  • Thermoelectric Modules
  • Thermal Sensors
  • Temperature Power Sensors
  • TEC & TEM Assemblies
Microelectronics
  • Semiconductor Die
  • Wafer Saw, Sort (to 300mm wafers)
  • Visual Inspection(Mil-STD-883)
  • Wafer Thinning (to 50 microns)
  • Wafer Bumping (gold, solder, RDL)
  • Long Term Wafer/Die Storage
  • Known Good Die (KGD)
  • Tape Automated Bond (TAB)
  • Radiation Hardened Die
  • Lot Qualification (Class H or K)
  • Wafer Level Programming
  • Wafer Probe (hi/low temperature
  • Plastic Packaging
  • Copper Lead Frames
  • Extended Temperature
  • CSP
  • QFN
  • BGA
  • SiP (System in Package)
  • Quality Certifications
  • AS9100:2009, ISO9001:2008
  • ITAR Registered
  • DSCC QML Mil-PRF-38535Q/V/H
  • SMD, Q and M Level
  • EEE-INST-002
  • Mil-STD-883, P1.2.1
  • DNA/Anti-Counterfeit
  • Hermetic Packaging
  • Ceramic 400/600 Mil DIP
  • SOJ
  • Two-sided LCC
  • Four-sided LCC
  • ZIP
  • Gull Wing
  • QFP
  • PGA
  • Flat Pack
  • Formed-lead Flat Pack
  • Metal Can
  • Testing & Inspection
  • Engineering & Analytical Services
  • Memory Devices Characterization
  • Element Evaluation
  • Contract Assembly
  • Environmental Screening
  • Burn-In/Life Testing
  • Hi-Temp Testing
  • PIND
  • SEM