Industrialization of high-density 3D integrated silicon capacitors
Caen, Oct. 22, 2015 – Two years after the launch of the PICS project (funded by the FP7 funding instrument dedicated to research for the benefit of SMEs), three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved during this program.
Started in September 2013, the PICS project was focused on developing innovative dielectric materials deposited by atomic layer deposition (ALD) and related tools (ALD batch tool and etching tool) to bring to mass production a new technology of high- density and high-voltage 3D trench capacitors targeting high-end markets like medical or aeronautics. Capacitors are key components presented in every electronic module. The integrated silicon capacitors technology offered by the SME IPDiA outperforms current technologies (using ceramic or tantalum substrates) in stability in temperature, voltage, aging and reliability and enables to build highly integrated and high-performance electronic modules.