Qualcomm is looking to leverage Monolithic 3D IC technology to win market share in the 8 billion dollar smart phone market.

Starting as soon as 2016 Qualcomm is looking to leverage Monolithic 3D IC technology to win market share in the 8 billion dollar smart phone market, said Karim Arabi, vice president of engineering at Qualcomm, speaking at the International Symposium on Physical Design (ISPD-2015, Mar. 29-April 1). This was reported by the EE Times blog titled 3D Qualcomm SoC Testing on Horizon. Arabi’s presentation slides, along with the corresponding CEA Leti slides, are now available on the ISPD-2015 conference site.

Qualcomm’s long term focus on Monolithic 3D was reviewed in our EE Times blog Qualcomm Calls for Monolithic 3D. Qualcomm calls it now “3DV” and plans to use it for future scaling. See the following slide presented by Arabi.

via Qualcomm to Leverage Monolithic 3D for Smartphones | EE Times.