Sony licenses bonding technology from Ziptronix
Ziptronix Inc., a developer and provider of low-temperature direct bonding interconnect (DBI) technology for 3D integration, has announced a patent licensing agreement with Sony Corp. for the application of its technology to image sensors.
Sony is the world’s leading supplier of CMOS image sensors and it is spending strongly to increase its production of stackedMultiple capacitor elements stacked in multi-unit arrangement to provide bulk capacitance and lower ESR.Multiple capacitor elements stackedMultiple capacitor elements stacked in multi-unit arrangement to provide bulk capacitance and lower ESR. in multi-unit arrangement to provide bulk capacitance and lower ESR. sensors in support of demand for them in smartphones and tablet computers.
Sony licensed ZiBond direct bonding patents in 2011 and its use of the techniques allowed by those patents has helped it become the largest supplier, Ziptronix said.
DBI is an extension of Ziptronix’ ZiBond technology that allows an interconnect pitch of less than 10-microns, and accommodates 1.5 million connections per square centimeter. The process uses standard fab tools to planarize the wafer surface and introduce a thin layer of silicon dioxide that then allows hermetic bonding at low temperatures.
“This license agreement with Sony is an exciting milestone for Ziptronix because it removes any doubt that our patented DBI hybrid bonding technology is both manufacturable and beneficial for high volume applications,” said Dan Donabedian, CEO and president of Ziptronix (Research Triangle Park, North Carolina), in a statement.
“We believe it demonstrates that our patented hybrid bonding technology is both enabling and cost effective as compared to stacking with TSVs. We expect this new license for Ziptronix’s DBI hybrid bonding patents will further contribute to Sony’s growth within the industry. Any company wishing to compete in this space will need Ziptronix’s DBI hybrid bonding patents.”