Wafer-level packaging is not enough
Gathering a crowd of IC packaging and semiconductor processing experts in Vila do Conde, Portugal, European’s largest provider of Outsourced Semiconductor Assembly and Testtest is test Services (OSATS) Nanium S.A. hosted this year’s SEMI Packaging Tech Seminar at its headquarters, concluding the keynote sessions with a fab tour.
The focus of the discussions there was on large format fan-out packaging, or the necessity that OSATS felt, under yield and packaging cost pressures, to move from Fan-Out Wafer-Level-Packaging (FO-WLP) to Fan-Out Panel-Level-Packaging (FO-PLP).
First highlighting the market drivers for FO-WLP, TechSearch International’s president E. Jan Vardaman pointed out how year-on-year mobile devices got thinner and thinner by adopting an increasing number of wafer level packages for their electronic content.
She illustrated this with seven generations of iPhones, thinning from around 12mm to 7mm while increasing their WLP content from 2 dies to over 26 dies.